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NCV8705MTADJTCG Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV8705MTADJTCG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 23 page NCV8705 www.onsemi.com 3 Table 1. PIN FUNCTION DESCRIPTION Pin Name Pin No. − Fixed DFN8/DFNW8 Pin No. − Adjustable DFN8/DFNW8 Pin No. − Fixed WDFN6 Pin No. − Adjustable WDFN6 Description OUT 1 1 1 1 Regulated output voltage pin. A small 1 mF ceramic capac- itor is needed from this pin to ground to assure stability. GND 4 4 3 3 Power supply ground. Expose pad must be tied with GND pin. Soldered to the copper plane allows for effective heat dissipation. EN 5 5 4 4 Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. IN 8 8 6 6 Input pin. A small capacitor is needed from this pin to ground to assure stability. ADJ − 3 − 2 Feedback pin for set−up output voltage. Use resistor di- vider for voltage selection. N/C 2, 3, 6, 7 2, 6, 7 2, 5 5 Not connected. This pin can be tied to ground to improve thermal dissipation. Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Adjustable Input VADJ −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s Maximum Junction Temperature TJ(MAX) 125 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. Table 3. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, WDFN6 2x2 mm Thermal Resistance, Junction−to−Air Thermal Resistance Parameter, Junction−to−Board qJA YJB 116.5 30 °C/W Thermal Characteristics, DFN8 3x3 mm / DFNW8 3x3 mm Thermal Resistance, Junction−to−Air Thermal Resistance Parameter, Junction−to−Board qJA YJB 92.6 35.1 °C/W 3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area. |
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