NCP103

www.onsemi.com

2

IN

OUT

BANDGAP

REFERENCE

ACTIVE

DISCHARGE*

MOSFET

DRIVER WITH

CURRENT LIMIT

THERMAL

SHUTDOWN

ENABLE

LOGIC

GND

AUTO LOW

POWER MODE

EN

EN

Figure 2. Simplified Schematic Block Diagram

*Active output discharge function is present only in NCP103AMXyyyTCG devices.

PIN FUNCTION DESCRIPTION

Pin No.

Pin Name

Description

1

OUT

Regulated output voltage pin. A small ceramic capacitor with minimum value of 1

mF is needed from this

pin to ground to assure stability.

2

GND

Power supply ground.

3

EN

Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown

mode.

4

IN

Input pin. A small capacitor is needed from this pin to ground to assure stability.

−

EPAD

Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows

for effective heat removal.

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

−0.3 V to 6 V

V

Output Voltage

V

Enable Input

V

Output Short Circuit Duration

∞

s

Maximum Junction Temperature

150

°C

Storage Temperature

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114,

ESD Machine Model tested per EIA/JESD22−A115,

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

Rating

Symbol

Value

Unit

Thermal Characteristics, uDFN4 1x1 mm

Thermal Resistance, Junction−to−Air

170

°C/W