FAN2558S15X datasheet(9/17 Pages) ONSEMI

9 / 17 page

FAN2558/FAN2559

PRODUCT SPECIFICATIONS

8

REV. 1.0.4 3/15/04

General PCB Layout Considerations

For optimum device performance, careful circuit layout and

grounding techniques must be used. Establishing a small

local ground, to which the GND pin, and the output and

bypass capacitors are connected, is recommended. The input

capacitor should be grounded to the main ground plane. The

quiet local ground is then routed back to the main ground

plane using feed through via. In general, the high-frequency

compensation components (input, bypass, and output capaci-

tors) should be located as close to the device as possible.

Close proximity of the output capacitor is especially impor-

tant to achieve optimum performance, especially during high

load conditions. A large copper area in the local ground

serves as heat sink (as discussed above) when high power

dissipation signiﬁcantly increases device temperature. Com-

ponent-side copper provides signiﬁcantly better thermal per-

formance. Added feed through connecting the device side

ground plane to the back plane further reduces thermal resis-

tance.

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