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FAN25800 Datasheet(PDF) 8 Page - ON Semiconductor

Part # FAN25800
Description  Low-Noise, LDO Regulator
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FAN25800 Datasheet(HTML) 8 Page - ON Semiconductor

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© 2014 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN25800
• Rev. 1.5
7
Circuit Description
The FAN25800 is a linear low-dropout (LDO) regulator
that has high PSRR and low output noise. The enable
control pin can be used to shut down the device and
disconnect the output load from the input. During
shutdown, the supply current drops below 1 µA. The
LDO is designed to be stable with space-saving ceramic
capacitors as small as 0201 case size.
Enable and Soft-Start
When EN is LOW, all circuits are off and the IC draws
<550 nA of current. The EN pin does not have an
internal pull-down resistor and must not be left floating.
When EN is HIGH and VIN is above the UVLO
threshold, the regulator begins a soft-start cycle for the
output. The soft-start cycle controls inrush current,
limiting it to the ILIM peak current limit.
Short-Circuit and Thermal Protection
The output current is short-circuit protected. When an
output fault occurs, the output current is automatically
limited to ILIM and VOUT drops. The resultant VOUT is
equal to ILIM multiplied by the fault impedance.
Short-circuit fault or output overload may cause the die
temperature to increase and exceed the maximum
rating
due
to
power
dissipation.
In
such
cases
(depending upon the ambient temperature; the VIN, load
current, and thermal resistance (θJB) of the mounted
die), the device may enter thermal shutdown.
If the die temperature exceeds the thermal shutdown
temperature threshold, the onboard thermal protection
disables the output until the temperature drops below its
hysteresis value. At that point, the output is re-enabled
and a new soft-start sequence occurs.
Thermal Considerations
For best performance, the die temperature and the
power dissipated should be kept at moderate values.
The maximum power dissipated can be evaluated
based on the following relationship:
JA
A
J
D
T
T
P
(max)
(max)
(1)
where TJ(max) is the maximum allowable junction
temperature of the die; TA is the ambient operating
temperature; and θJA is dependent on the
surrounding PCB layout and can be improved by
providing a heat sink of surrounding copper ground.
The addition of backside copper with through-holes,
stiffeners, and other enhancements can help red
uce θJA.
The heat contributed by the dissipation of devices
nearby must be included in design considerations.
Capacitor Selection
An output capacitor with an effective capacitance
between 400 nF and 15 µF is required for loop stability.
The ESR value should be within 3 to 100 m
. DC bias
characteristics of the capacitors must be considered
when selecting the voltage rating and the case size of
the capacitor. Figure 16 is a typical derating curve for a
0201 case size, 1.5 µF, 6.3 V, X5R capacitor.
Figure 16. Capacitor DC Bias Characteristics
Typical Application for Post Regulation
Due to its high PSRR and low output noise, the
FAN25800 can be used as a post-DC-DC regulator to
reduce output ripple and output noise at high efficiency
for noise-sensitive applications. Figure 17 shows a post-
DC-DC regulation of the LDO with a buck converter.
The capacitor on the output of the buck converter can
be shared by the LDO as its input capacitor.
DC-DC
Converter
FAN25800
EN
EN
L
C2
C1
C3
VIN
VOUT
3.6 V
3.3 V
5.0 V
VIN
SW
GND
GND
Figure 17. LDO as Post DC-DC Regulator
PCB Layout Recommendations
Capacitors should be placed as close to the IC as
possible. All power and ground pins should be routed to
their capacitors using top copper. The copper area
connecting to the IC should be maximized to improve
thermal performance.
Figure 18. Recommended Layout


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