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SMCJ48A Datasheet(PDF) 1 Page - Littelfuse |
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SMCJ48A Datasheet(HTML) 1 Page - Littelfuse |
1 / 6 page Transient Voltage Suppression Diodes © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Surface Mount – 1500W > SMCJ series TVS devices are ideal for the protection of I/O Interfaces, V CC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Applications Features The SMCJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Description Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2), (Note 5) P PPM 1500 W Power Dissipation on Infinite Heat Sink at T L=50 O C P D 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) I FSM 200 A Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only (Note 4) V F 3.5/5.0 V Operating Temperature Range T J -65 to 150 °C Storage Temperature Range T STG -65 to 175 °C Typical Thermal Resistance Junction to Lead R θJL 15 °C/W Typical Thermal Resistance Junction to Ambient R θJA 75 °C/W Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above T J (initial) =25 O C per Fig. 3. 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. V F < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. The P PPM of stacked-die parts is 2000W and please contact littelfuse for the detail stacked-die parts. Maximum Ratings and Thermal Characteristics (T A=25 O C unless otherwise noted) Agency Approvals AGENCY AGENCY FILE NUMBER E230531 • 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • Excellent clamping capability • Low incremental surge resistance • Typical I R less than 1μA when V BR min>12V • For surface mounted applications to optimize board space • Low profile package • Built-in strain relief • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Fast response time: typically less than 1.0ps from 0V to BV min • Glass passivated chip junction • High temperature to reflow soldering guaranteed: 260°C/40sec • V BR @ TJ= VBR@25°C x (1+αT x (T J - 25)) (αT:Temperature Coefficient, typical value is 0.1%) • Plastic package is flammability rated V-0 per Underwriters Laboratories • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01) SMCJ Series Uni-directional Bi-directional Functional Diagram Bi-directional Uni-directional Cathode Anode RoHS Pb e3 Datasheet Additional Infomarion Resources Samples |
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