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SMF60A Datasheet(PDF) 1 Page - Littelfuse |
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SMF60A Datasheet(HTML) 1 Page - Littelfuse |
1 / 6 page Transient Voltage Suppression Diodes © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/06/17 Surface Mount – 200W > SMF Series Description Features Maximum Ratings and Thermal Characteristics (T A=25 O C unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A=25ºC by 10/1000µs (Note 1) P PPM 200 W Thermal Resistance Junction- to- Ambient R θJA 220 °C/W Thermal Resistance Junction- to- Lead R θJL 100 °C/W Operating Temperature Range T J -65 to 150 °C Storage Temperature Range T STG -65 to 175 °C Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above T J (initial) =25ºC per Fig. 3. The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1.1mm) in the industry. Applications SMF devices are ideal for the protection of I/O interfaces, V CC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications. • 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% •Compatible with industrial standard package SOD-123FL • Low profile: maximum height of 1.1mm. • Low inductance, excellent clamping capability • For surface mounted applications to optimize board space • High temperature to reflow soldering guaranteed: 260°C/40sec • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Fast response time: typically less than 1.0ns from 0 Volts to V BR min • Glass passivated junction • Built-in strain relief • Plastic package is flammability rated V-0 per Underwriters Laboratories • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen-free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD- 609A.01) AGENCY AGENCY FILE NUMBER E230531 Agency Approvals SMF Series Functional Diagram Bi-directional Uni-directional Cathode Anode Uni-directional RoHS Pb e3 Datasheet Additional Infomarion Resources Samples |
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