DG636E

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Vishay Siliconix

S17-1518-Rev. B, 09-Oct-17

4

Document Number: 75621

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Notes

b. All leads welded or soldered to PC board

c. Derate 5.6 mW/°C above 70 °C

d. Derate 6.6 mW/°C above 70 °C

e. Manual soldering with iron is not recommended for leadless components. The miniQFN-16 is a leadless package. The end of the lead

terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip

cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection

Power Supply

Power supply current

I+

Room

0.0004

-

0.5

-

0.5

μA

Full

-

-

1

-

1

Negative supply

current

I-

Room

-0.0004

-0.5

-

-0.5

-

Full

-

-1

-

-1

-

Ground current

Room

-0.0004

-0.5

-

-0.5

-

Full

-

-1

-

-1

-

SPECIFICATIONS FOR DUAL SUPPLIES (V+ = 5 V, V- = -5 V)

PARAMETER

SYMBOL

TEST CONDITIONS

UNLESS OTHERWISE

SPECIFIED

V+ = 5 V, V- = -5 V

-40 °C to +125 °C

-40 °C to +85 °C

UNIT