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74LVC1G175 Datasheet(PDF) 14 Page - NXP Semiconductors |
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74LVC1G175 Datasheet(HTML) 14 Page - NXP Semiconductors |
14 / 17 page 9397 750 13762 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 18 October 2004 14 of 17 Philips Semiconductors 74LVC1G175 Single D-type flip-flop with reset; positive-edge trigger Fig 11. Package outline SOT886 (XSON6). terminal 1 index area REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT886 MO-252 SOT886 04-07-15 04-07-22 DIMENSIONS (mm are the original dimensions) XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm D E e1 e A1 b L L1 e1 0 1 2 mm scale Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. UNIT mm 0.25 0.17 1.5 1.4 0.35 0.27 A1 max b E 1.05 0.95 D ee1 L 0.40 0.32 L1 0.5 0.6 A(1) max 0.5 0.04 1 6 2 5 3 4 6 × (2) 4 × (2) A |
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