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CY62167GN18-55BVXIT Datasheet(PDF) 8 Page - Cypress Semiconductor

Part # CY62167GN18-55BVXIT
Description  16-Mbit (1M16/2M 횞 8) Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY62167GN18-55BVXIT Datasheet(HTML) 8 Page - Cypress Semiconductor

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Document Number: 001-93628 Rev. *D
Page 8 of 19
CY62167GN MoBL®
Switching Characteristics
Parameter[20]
Description
45 ns
55 ns
Unit
Min
Max
Min
Max
Read Cycle
tRC
Read cycle time
45.0
55.0
ns
tAA
Address to data valid
45.0
55.0
ns
tOHA
Data hold from address change
10.0
10.0
ns
tACE
CE1 LOW and CE2 HIGH to data valid
45.0
55.0
ns
tDOE
OE LOW to data valid
22.0
25.0
ns
tLZOE
OE LOW to Low Z [21, 22]
5.0
5.0
ns
tHZOE
OE HIGH to High Z [21, 22, 23]
18.0
18.0
ns
tLZCE
CE1 LOW and CE2 HIGH to Low Z [21, 22]
10.0
10.0
ns
tHZCE
CE1 HIGH and CE2 LOW to High Z [21, 22, 23]
18.0
18.0
ns
tPU
CE1 LOW and CE2 HIGH to power-up[24]
0
0
ns
tPD
CE1 HIGH and CE2 LOW to power-down[24]
45.0
55.0
ns
tDBE
BLE / BHE LOW to data valid
45.0
55.0
ns
tLZBE
BLE / BHE LOW to Low Z [21, 22]
5.0
5.0
ns
tHZBE
BLE / BHE HIGH to High Z [21, 22, 23]
18.0
18.0
ns
Write Cycle[25, 26]
tWC
Write cycle time
45
55
ns
tSCE
CE1 LOW and CE2 HIGH to write end
35
40
ns
tAW
Address setup to write end
35
40
ns
tHA
Address hold from write end
0
0
ns
tSA
Address setup to write start
0
0
ns
tPWE
WE pulse width
35
40
ns
tBW
BLE / BHE LOW to write end
35
40
ns
tSD
Data setup to write end
25
25
ns
tHD
Data hold from write end
0
0
ns
tHZWE
WE LOW to High Z [21, 22, 23]
18
20
ns
tLZWE
WE HIGH to Low Z [21, 22]
10
10
ns
Notes
20. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 V/ns, timing reference levels of VCC(typ)/2, input pulse levels of 0
to VCC(typ), and output loading of the specified IOL/IOH as shown in Figure 3 on page 6.
21. At any temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any device.
22. Tested initially and after any design or process changes that may affect these parameters.
23. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedance state.
24. These parameters are guaranteed by design and are not tested.
25. The internal write time of the memory is defined by the overlap of WE, CE1 = VIL, BHE or BLE or both = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a
write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write
26. The minimum write cycle pulse width for Write Cycle No. 3 (WE Controlled, OE LOW) should be equal to the sum of tHZWE and tSD.


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