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CY62167GN Datasheet(PDF) 6 Page - Cypress Semiconductor |
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CY62167GN Datasheet(HTML) 6 Page - Cypress Semiconductor |
6 / 19 page Document Number: 001-93628 Rev. *D Page 6 of 19 CY62167GN MoBL® Capacitance Parameter [12] Description Test Conditions Max Unit CIN Input capacitance TA = 25 °C, f = 1 MHz, VCC = VCC(typ) 10 pF COUT Output capacitance 10 pF Thermal Resistance Parameter [12] Description Test Conditions 48-ball VFBGA 48-pin TSOP I Unit JA Thermal resistance (junction to ambient) Still air, soldered on a 3 × 4.5 inch, four-layer printed circuit board 31.50 57.99 °C/W JC Thermal resistance (junction to case) 15.75 13.42 °C/W AC Test Loads and Waveforms Figure 3. AC Test Loads and Waveforms VHIGH VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90% 10% 90% 10% Rise Time = 1 V/ns Fall Time = 1 V/ns OUTPUT VTH Equivalent to: THÉVENIN EQUIVALENT ALL INPUT PULSES RTH R1 Parameters 1.8 V 2.5 V 3.0 V 5.0 V Unit R1 13500 16667 1103 1800 R2 10800 15385 1554 990 RTH 6000 8000 645 639 VTH 0.80 1.20 1.75 1.77 V VHIGH 1.8 2.5 3.0 5.0 V Note 12. Tested initially and after any design or process changes that may affect these parameters. |
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