Document Number: 001-93628 Rev. *D

Page 6 of 19

Capacitance

Parameter [12]

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Parameter [12]

Description

Test Conditions

48-ball VFBGA 48-pin TSOP I Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch,

four-layer printed circuit board

31.50

57.99

°C/W

Thermal resistance

(junction to case)

15.75

13.42

°C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1

Parameters

1.8 V

2.5 V

3.0 V

5.0 V

Unit

13500

16667

1103

1800



10800

15385

1554

990



6000

8000

645

639



0.80

1.20

1.75

1.77

V

1.8

2.5

3.0

5.0

V

Note

12. Tested initially and after any design or process changes that may affect these parameters.