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UCC21222D Datasheet(PDF) 5 Page - Texas Instruments |
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UCC21222D Datasheet(HTML) 5 Page - Texas Instruments |
5 / 43 page 5 UCC21222 www.ti.com SLUSCX6 – FEBRUARY 2018 Product Folder Links: UCC21222 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) UCC21222 UNIT D (SOIC) 16 PINS RθJA Junction-to-ambient thermal resistance 68.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 30.5 °C/W RθJB Junction-to-board thermal resistance 22.8 °C/W ψJT Junction-to-top characterization parameter 17.1 °C/W ψJB Junction-to-board characterization parameter 22.5 °C/W 6.5 Power Ratings VALUE UNIT PD Power dissipation VCCI = 5.5 V, VDDA/B = 12 V, INA/B = 3.3 V, 5.4 MHz 50% duty cycle square wave 1.0- nF load 1825 mW PDI Power dissipation by transmitter side 15 mW PDA, PDB Power dissipation by each driver side 905 mW |
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