CY14B116L/CY14B116N/CY14B116S

CY14E116L/CY14E116N/CY14E116S

Document Number: 001-67793 Rev. *N

Page 7 of 37

Pin Definitions

Pin Name

I/O Type

Description

Input

Address inputs. Used to select one of the 2,097,152 bytes of the nvSRAM for the ×8 configuration.

Address inputs. Used to select one of the 1,048,576 words of the nvSRAM for the ×16 configuration.

Address inputs. Used to select one of the 524,288 words of the nvSRAM for the ×32 configuration.

Input/Output

Bidirectional data I/O lines for the ×8 configuration. Used as input or output lines depending on

operation.

Bidirectional data I/O lines for the ×16 configuration. Used as input or output lines depending on

operation.

Bidirectional data I/O lines for ×32 configuration. Used as input or output lines depending on

operation.

WE

Input

Write Enable input, Active LOW. When selected LOW, data on the I/O pins is written to the specific

address location.

CE

Input

Chip Enable input in TSOP II package, Active LOW. When LOW, selects the chip. When HIGH,

deselects the chip.

Chip Enable input in FBGA package. The device is selected and a memory access begins on the

OE

Input

Output Enable, Active LOW. The Active LOW OE input enables the data output buffers during read

cycles. Deasserting OE HIGH causes the I/O pins to tristate.

Input

Input

Input

Input

ZZ[9]

Input

Sleep Mode Enable. When the ZZ pin is pulled LOW, the device enters a low-power Sleep mode and

consumes the lowest power. Since this input is logically AND’ed with CE, ZZ must be HIGH for normal

operation.

Power Supply Power supply inputs to the device.

Power Supply Ground for the device. Must be connected to ground of the system.

HSB

Input/Output

Hardware STORE Busy (HSB).When LOW, this output indicates that a Hardware STORE is in progress.

When pulled LOW external to the chip it initiates a nonvolatile STORE operation. After each Hardware

current and then a weak internal pull-up resistor keeps this pin HIGH (external pull-up resistor connection

optional).

Power Supply

AutoStore capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to

nonvolatile elements.

NC

NC

No Connect. Die pads are not connected to the package pin.

Notes

9. Sleep mode feature is offered in 165-ball FBGA package only.