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CY7C21701KV18 Datasheet(PDF) 3 Page - Cypress Semiconductor

Part # CY7C21701KV18
Description  18-Mbit DDR II SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) with ODT
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C21701KV18 Datasheet(HTML) 3 Page - Cypress Semiconductor

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CY7C21701KV18
Document Number: 001-57344 Rev. *A
Page 3 of 24
Contents
Features............................................................................. 1
Configurations .................................................................. 1
Functional Description..................................................... 1
Logic Block Diagram (CY7C21701KV18)........................ 2
Contents ............................................................................ 3
Pin Configuration ............................................................. 4
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout .................. 4
Pin Definitions .................................................................. 5
Functional Overview ........................................................ 7
Read Operations ......................................................... 7
Write Operations ......................................................... 7
Byte Write Operations ................................................. 7
DDR Operation............................................................ 7
Depth Expansion ......................................................... 7
Programmable Impedance .......................................... 7
Echo Clocks ................................................................ 7
Valid Data Indicator (QVLD)........................................ 8
On-Die Termination (ODT) .......................................... 8
PLL .............................................................................. 8
Application Example ........................................................ 8
Truth Table ........................................................................ 9
Write Cycle Descriptions ................................................. 9
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 10
Disabling the JTAG Feature ...................................... 10
Test Access Port—Test Clock................................... 10
Test Mode Select (TMS) ........................................... 10
Test Data-In (TDI) ..................................................... 10
Test Data-Out (TDO)................................................. 10
Performing a TAP Reset ........................................... 10
TAP Registers ........................................................... 10
TAP Instruction Set ................................................... 10
TAP Controller State Diagram ....................................... 12
TAP Controller Block Diagram ...................................... 13
TAP Electrical Characteristics ...................................... 13
TAP AC Switching Characteristics ............................... 14
TAP Timing and Test Conditions .................................. 14
Identification Register Definitions ................................ 15
Scan Register Sizes ....................................................... 15
Instruction Codes ........................................................... 15
Boundary Scan Order .................................................... 16
Power Up Sequence in DDR II+ SRAM ......................... 17
Power Up Sequence ................................................. 17
PLL Constraints......................................................... 17
Maximum Ratings........................................................... 18
Operating Range............................................................. 18
Neutron Soft Error Immunity ......................................... 18
Electrical Characteristics............................................... 18
DC Electrical Characteristics..................................... 18
AC Electrical Characteristics ..................................... 19
Capacitance .................................................................... 20
Thermal Resistance........................................................ 20
Switching Characteristics.............................................. 21
Switching Waveforms .................................................... 22
Read/Write/Deselect Sequence ................................ 22
Ordering Information...................................................... 23
Package Diagram............................................................ 23
Document History Page ................................................. 24
Sales, Solutions, and Legal Information ...................... 24
Worldwide Sales and Design Support....................... 24
Products .................................................................... 24
PSoC Solutions ......................................................... 24
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