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CY62157DV18
MoBL2
Document #: 38-05126 Rev. *B
Page 4 of 10
AC Test Loads and Waveforms
Thermal Resistance
Parameter
Description
Test Conditions
BGA
Unit
θ
JA
Thermal Resistance (Junction to
Ambient)[6]
Still Air, soldered on a 3 x 4.5 inch, two-layer
printed circuit board
55
C/W
θ
JC
Thermal Resistance (Junction to
Case)[6]
16
C/W
Data Retention Characteristics
Parameter
Description
Conditions
Min.
Typ.[5]
Max.
Unit
VDR
VCC for Data Retention
1.0
1.95
V
ICCDR
Data Retention Current
VCC = 1.0V, CE1 > VCC – 0.2V, CE2
< 0.2V, VIN > VCC − 0.2V or VIN <
0.2V
L1
10
µA
LL
3
tCDR
[6]
Chip Deselect to Data
Retention Time
0ns
tR
[7]
Operation Recovery Time
tRC
ns
Data Retention Waveform[8]
Notes:
7.
Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.
8.
BHE
.
BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
VCC Typ
VCC
OUTPUT
R2
C = 30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
V
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Rise Time:
1 V/ns
Fall Time:
1 V/ns
L
Parameters
1.8V
UNIT
R1
13500
Ω
R2
10800
Ω
R
TH
6000
Ω
V
TH
0.80
V
VCC(min.)
VCC(min.)
tCDR
VDR > 1.0V
DATA RETENTION MODE
tR
CE1 or
VCC
BHE .BLE
CE2
or
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