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OPA2170AIDR Datasheet(PDF) 8 Page - Texas Instruments |
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OPA2170AIDR Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 56 page  8 OPA170, OPA2170, OPA4170 SBOS557D – AUGUST 2011 – REVISED OCTOBER 2017 www.ti.com Product Folder Links: OPA170 OPA2170 OPA4170 Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: OPA170 THERMAL METRIC(1) OPA170 UNIT D (SOIC) DBV (SOT-23) DRL (SOT) 8 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 149.5 245.8 208.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 97.9 133.9 0.1 °C/W RθJB Junction-to-board thermal resistance 87.7 83.6 42.4 °C/W ψJT Junction-to-top characterization parameter 35.5 18.2 0.5 °C/W ψJB Junction-to-board characterization parameter 89.5 83.1 42.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: OPA2170 THERMAL METRIC(1) OPA2170 UNIT D (SOIC) DCU (VSSOP, micro size) DGK (VSSOP) DSG (WSON) 8 PINS 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.3 175.2 180 71.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.1 74.9 55 89.1 °C/W RθJB Junction-to-board thermal resistance 60.6 22.2 130 38.8 °C/W ψJT Junction-to-top characterization parameter 18.2 1.6 5.3 3.8 °C/W ψJB Junction-to-board characterization parameter 53.8 22.8 120 38.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 13 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: OPA4170 THERMAL METRIC(1) OPA4170 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
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