Document Number: 002-08496 Rev. *D

Page

10 of 20

S6BP202A

Parameter

Symbol

Condition

Value

Unit

Min

Typ

Max

Thermal

shutdown

block (TSD)

Shutdown temperature

−

−

165 (*2)

−

°C

Hysteresis

−

10 (*2)

−

°C

Supply current

Shutdown current

−

1

5

µA

Quiescent current

MODE/SYNC/PG Pins = OPEN

−

20

40

µA

*1: Refer to "1. Product Lineup"

*2: The electrical characteristic is ensured by statistical characterization and indirect tests.

8.

Functional Description

8.1

Block Description

Input Under Voltage Lockout (Input UVLO)

The input UVLO is the function that prevents a malfunction of this IC from the following status, and protects poststage devices.



Transitional state at start-up



Momentary drop of power supply voltage

To prevent such a malfunction, this protection monitors the VIN input voltage and VCC voltage. When either VIN or VCC voltage falls

to the UVLO falling threshold, 2.4V (Typ), or lower, the IC stops the VOUT voltage output and becomes UVLO status. When both VIN

and VCC voltages reach the UVLO rising threshold, 4.75V (Typ), or higher, the IC is released from the UVLO state and returns to the

normal operation.

Output Under Voltage Protection (Output UVP)

The output UVP is the function that monitors the voltage drop of the VOUT pin and notifies by the PG pin.

the low level. The IC becomes the UVP status, but the switching operation is maintained under the UVP status.

released from the UVP state and the PG voltage is fixed to the high level.

Output Over Voltage Protection (Output OVP)

The output OVP is the function that monitors the voltage rise of the VOUT pin and stops the switching operations, which protects

poststage devices from overvoltage. Also, the VOUT state is notified by the PG pin.

the low level. The IC becomes the OVP status, and the switching operations of the high-Side FETs are stopped. When the output

state and resumes the switching operations. The PG voltage is fixed to the high level again.

Output Over Current Protection (Output OCP)

The output OCP is the function that limits the excessive current load and protects poststage devices.

Thermal Shutdown (TSD)

The TSD is the function that protects the IC from heat-destruction. When the junction temperature reaches +165°C (Typ), the

high-side and low-side switching FET are turned off and the IC becomes the TSD status. When the junction temperature once again

falls to +155°C (Typ) or lower, the IC is released from the TSD state and restarts the power supply.