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TLV2460A Datasheet(PDF) 2 Page - Texas Instruments

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Part No. TLV2460A
Description  FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT OPERATIOANAL AMPLIFIERS WITH SHUTDOWN
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TLV2460A Datasheet(HTML) 2 Page - Texas Instruments

 
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TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW-POWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220I – JULY 1998 – REVISED MARCH 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
V
max
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL OUTLINE
(D)
SOT-23†
(DBV)
SYMBOL
PLASTIC DIP
(P)
0
°C to 70°C
2000
µV
TLV2460CD
TLV2461CD
TLV2460CDBV
TLV2461CDBV
VAOC
VAPC
TLV2460CP
TLV2461CP
– 40
°Cto125°C
2000
µV
TLV2460ID
TLV2461ID
TLV2460IDBV
TLV2461IDBV
VAOI
VAPI
TLV2460IP
TLV2461IP
– 40
°C to 125°C
1500
µV
TLV2460AID
TLV2461AID
TLV2460AIP
TLV2461AIP
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).
‡ Chip forms are tested at TA = 25°C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
SMALL
OUTLINE†
(PW)
CERAMIC DIP
(JG)
CERAMIC
FLATPACK
(U)
CHIP CARRIER
(FK)
– 40
°Cto125°C
2000
µV
TLV2460QD
TLV2461QD
TLV2460QPW
TLV2461QPW
– 40
°C to 125°C
1500
µV
TLV2460AQD
TLV2461AQD
TLV2460AQPW
TLV2461AQPW
55
°Cto125°C
2000
µV
TLV2460MJG
TLV2461MJG
TLV2460MU
TLV2461MU
TLV2460MFK
TLV2461MFK
–55
°C to 125°C
1500
µV
TLV2460AMJG
TLV2461AMJG
TLV2460AMU
TLV2461AMU
TLV2460AMFK
TLV2461AMFK
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).
TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
MSOP
(DGK)
SYMBOL
MSOP†
(DGS)
SYMBOL
PLASTIC DIP
(N)
PLASTIC DIP
(P)
0
°C to 70°C
2000
µV
TLV2462CD
TLV2463CD
TLV2462CDGK
xxTIAAI
TLV2463CDGS
xxTIAAK
TLV2463CN
TLV2462CP
– 40
°C to
2000
µV
TLV2462ID
TLV2463ID
TLV2462IDGK
xxTIAAJ
TLV2463IDGS
xxTIAAL
TLV2463IN
TLV2462IP
125
°C
1500
µV
TLV2462AID
TLV2463AID
TLV2463AIN
TLV2462AIP
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).
‡ Chip forms are tested at TA = 25°C only.


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