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TLE202XA Datasheet(PDF) 2 Page - Texas Instruments

Part No. TLE202XA
Description  EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TLE202XA Datasheet(HTML) 2 Page - Texas Instruments

 
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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191B – FEBRUARY 1997 – REVISED JANUARY 2002
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2021 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
SSOP‡
(DB)
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP‡
(PW)
CHIP
FORM§
(Y)
0
°C to
200
µV
TLE2021ACD
TLE2021CDBLE
TLE2021ACP
70
°C
µ
500
µV
TLE2021CD
TLE2021CDBLE
TLE2021CP
TLE2021CPWLE
TLE2021Y
– 40
°C
to
200
µV
TLE2021AID
TLE2021AIP
to
85
°C
µ
500
µV
TLE2021ID
TLE2021AIP
TLE2021IP
– 55
°C
100
µV
TLE2021BMFK
TLE2021BMJG
to
µ
200
µV
TLE2021AMD
TLE2021AMFK
TLE2021AMJG
TLE2021AMP
125
°C
500
µV
TLE2021MD
TLE2021MFK
TLE2021MJG
TLE2021MP
† The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
‡ The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25
°C only.
TLE2022 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
SSOP‡
(DB)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CHIP
FORM§
(Y)
0
°C
to
150
µV
300
µV
TLE2022BCD
TLE2022ACD
TLE2022ACP
to
70
°C
300
µV
500
µV
TLE2022ACD
TLE2022CD
TLE2022CDBLE
TLE2022ACP
TLE2022CP
TLE2022CPWLE
TLE2022Y
– 40
°C
to
150
µV
300
µV
TLE2022BID
TLE2022AID
TLE2022AIP
to
85
°C
300
µV
500
µV
TLE2022AID
TLE2022ID
TLE2022AIP
TLE2022IP
– 55
°C
150
µV
TLE2022BMJG
55 C
to
150
µV
300
µV
TLE2022AMD
TLE2022AMFK
TLE2022BMJG
TLE2022AMJG
TLE2022AMP
125
°C
µ
500
µV
TLE2022MD
TLE2022MFK
TLE2022MJG
TLE2022MP
† The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
‡ The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25
°C only.
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25
°C
SMALL
OUTLINE
(DW)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
CHIP
FORM§
(Y)
500
µV TLE2024BCDW
TLE2024BCN
0
°C to 70
°C
500
µV
750
µV
TLE2024BCDW
TLE2024ACDW
TLE2024BCN
TLE2024ACN
µ
1000
µV TLE2024CDW
TLE2024CN
TLE2024Y
500
µV TLE2024BIDW
TLE2024BIN
– 40
°C to 85°C
500
µV
750
µV
TLE2024BIDW
TLE2024AIDW
TLE2024BIN
TLE2024AIN
µ
1000
µV TLE2024IDW
TLE2024IN
500
µV TLE2024BMDW
TLE2024BMFK
TLE2024BMJ
TLE2024BMN
– 55
°C to 125°C
µ
750
µV TLE2024AMDW
TLE2024AMFK
TLE2024AMJ
TLE2024AMN
1000
µV TLE2024MDW
TLE2024MFK
TLE2024MJ
TLE2024MN
§ Chip forms are tested at 25
°C only.


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