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FAN53526UC106X Datasheet(PDF) 4 Page - ON Semiconductor |
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FAN53526UC106X Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 22 page FAN53526 www.onsemi.com 4 ABSOLUTE MAXIMUM RATINGS Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Table 5. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Parameter Min Max Unit VIN Voltage on SW, VIN Pins IC Not Switching −0.3 7.0 V IC Switching −0.3 6.5 Voltage on EN Pin −0.3 VIN (Note 3) Voltage on All Other Pins IC Not Switching −0.3 VIN (Note 3) VOUT Voltage on VOUT Pin −0.3 6.5 V VINOV_SLEW Maximum Slew Rate of VIN > 6.5V, PWM Switching 100 V/ms ESD Human Body Model, ANSI/ESDA/JEDEC JS−001−2012 2000 V Charged Device Model per JESD22−C101 1000 TJ Junction Temperature −40 +150 °C TSTG Storage Temperature −65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C 3. Lesser of 7V or VIN + 0.3 V. RECOMMENDED OPERATING CONDITIONS The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. On Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Table 6. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min. Typ. Max. Unit VIN Supply Voltage Range 2.5 5.5 V IOUT Output Current 0 3.0 A TA Operating Ambient Temperature −40 +85 °C TJ Operating Junction Temperature −40 +125 °C Table 7. THERMAL PROPERTIES Symbol Parameter Min. Typ. Max. Unit θJA Junction−to−Ambient Thermal Resistance (Note 4) 42 °C/W 4. Junction−to−ambient thermal resistance is a function of application and board layout. This data is simulated with four−layer 2s2p boards with vias in accordance to JESD51− JEDEC standard. Special attention must be paid not to exceed the junction temperature |
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