FAN53526

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4

ABSOLUTE MAXIMUM RATINGS

Stresses exceeding the absolute maximum ratings may

damage the device. The device may not function or be

operable above the recommended operating conditions and

stressing the parts to these levels is not recommended. In

addition, extended exposure to stresses above the

recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings

only.

Table 5. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Parameter

Min

Max

Unit

Voltage on SW, VIN Pins

IC Not Switching

−0.3

7.0

V

IC Switching

−0.3

6.5

Voltage on EN Pin

−0.3

VIN

(Note 3)

Voltage on All Other Pins

IC Not Switching

−0.3

VIN

(Note 3)

Voltage on VOUT Pin

−0.3

6.5

V

100

V/ms

ESD

Human Body Model, ANSI/ESDA/JEDEC JS−001−2012

2000

V

Charged Device Model per JESD22−C101

1000

Junction Temperature

−40

+150

°C

Storage Temperature

−65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

RECOMMENDED OPERATING CONDITIONS

The Recommended Operating Conditions table defines

the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal

performance to the datasheet specifications. On

Semiconductor does not recommend exceeding them or

designing to Absolute Maximum Ratings.

Table 6. RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

2.5

5.5

V

Output Current

0

3.0

A

Operating Ambient Temperature

−40

+85

°C

Operating Junction Temperature

−40

+125

°C

Table 7. THERMAL PROPERTIES

Symbol

Parameter

Min.

Typ.

Max.

Unit

Junction−to−Ambient Thermal Resistance

(Note 4)

42

°C/W

4. Junction−to−ambient thermal resistance is a function of application and board layout. This data is simulated with four−layer 2s2p boards with

vias in accordance to JESD51− JEDEC standard. Special attention must be paid not to exceed the junction temperature