NCP3418, NCP3418A

http://onsemi.com

3

MAXIMUM RATINGS*

Rating

Value

Unit

0 to 85

°C

0 to 150

°C

Package Thermal Resistance: SO−8

45

123

°C/W

°C/W

Package Thermal Resistance: SO−8 EP

50

°C/W

−65 to 150

°C

Lead Temperature Soldering (10 sec): Reflow (SMD styles only)

Standard (Note 3)

Lead Free (Note 4)

240 peak

260 peak

°C

JEDEC Moisture Sensitivity Level

SO−8 (240 peak profile)

SO−8 (260 peak profile)

SO−8 EP (240 peak profile)

SO−8 EP (260 peak profile)

1

1

1

3

−

1. Internally limited by thermal shutdown, 150

°C min.

2. Rating applies when soldered to an appropriate thermal area on the PCB.

3. 60 − 180 seconds minimum above 183

°C.

4. 60 − 180 seconds minimum above 237

°C.

*The maximum package power dissipation must be observed.

NOTE:

This device is ESD sensitive. Use standard ESD precautions when handling.

MAXIMUM RATINGS

Pin Symbol

Pin Name

Main Supply Voltage Input

15 V

−0.3 V

BST

Bootstrap Supply Voltage Input

30 V wrt/PGND

35 V

v 50 ns wrt/PGND

15 V wrt/SW

−0.3 V wrt/SW

SW

Switching Node

(Bootstrap Supply Return)

30 V

−1.0 V DC

−10 V< 200 ns

DRVH

High−Side Driver Output

BST + 0.3 V

35 V

v 50 ns wrt/PGND

15 V wrt/SW

−0.3 V wrt/SW

DRVL

Low−Side Driver Output

−0.3 V DC

−2.0 V < 200 ns

IN

DRVH and DRVL Control Input

−0.3 V

OD

Output Disable

−0.3 V

PGND

Ground

0 V

0 V

NOTE:

All voltages are with respect to PGND except where noted.