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OP296AB Datasheet(PDF) 4 Page - TT Electronics.

Part # OP296AB
Description  Plastic Infrared Emitting Diode
Download  9 Pages
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Manufacturer  TTELEC [TT Electronics.]
Direct Link  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

OP296AB Datasheet(HTML) 4 Page - TT Electronics.

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© TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without
notice or liability. All information is subject to TT Electronics’ own data and is
considered accurate at time of going to print.
OP290 Series
Issue D
07/2016
Page 4
OPTEK Technology, Inc.
1645 Wallace Drive, Carrollton, TX 75006|Ph: +1 972 323 2200
www.optekinc.com | www.ttelectronics.com
Absolute Maximum Ratings (TA = 25° C unless otherwise noted)
Maximum Duty Cycle
OP290 (25 µs pulse width @ 5 A)
1.25%
(1)
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 seconds with soldering iron]
260° C
(2)
Power Dissipation, Free Air
OP290, OP291, OP292, OP295, OP296, OP297
OP293, OP298
Power Dissipation, Board Mounted
OP290, OP291, OP292, op295, OP296, OP297
OP293, OP298
Power Dissipation, Full Heat Sink
OP290, OP291, OP292, OP295, OP296, OP297
OP293, OP298
333 mW
(3)
142 mW
(3)
533 mW
(4)
200 mW
(4)
1.11 W
(5)
400 mW
(5)
Power Dissipation
OP294, OP299
180 mW
Electrical Specifications
Notes:
1. For OP290, OP291, OP292, OP295, OP296 and OP297, refer to graph of Maximum Peak Pulse Current vs Pulse Width.
2. For all OPs in this series, RMA flux is recommended. Duration can be extended to 10 second maximum when soldering. A maximum of 20 grams
force may be applied to the leads when flow soldering.
3. For OP290, OP291, OP292, OP295, OP296 and OP297, measured in free-air. Derate linearly 3.33 mW/° C above 25° C.
4. For OP290, OP291and OP292, mounted on 1/16” (1.6 mm) thick PCBoard with each lead soldered through 80 mil square lands 0.250” (6.35 mm)
below flange of device. Derate linearly 5.33 mW/°C above 62.5°. For OP293 and OP298, mounted on 1/16” (1.60 mm) thick PCBoard with each
lead soldered through 80 mil square lands 0.250” (6.35 mm) below flange of device. Derate power dissipation linearly 2.00 mW/°C above 25° C
(normal use). For OP295, OP296 and OP297, mounted on 1/16” (1.6 mm) thick PCBoard with each lead soldered through 80 mil square lands
0.250” (6.35 mm) below flange of device. Derate linearly 5.33 mW/°C above
25° C.
5. Immersed in silicone fluid to simulate infinite heat sink. For OP290, OP291 and OP292, derate linearly 11.1 mW/°C above 95°C. For OP293 and
OP298, derate power dissipation linearly 2.50 mW/° C above 25° C. For OP295, OP296 and OP297, derate linearly 11.1 mW/° C above 25° C.


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