Si5351A/B/C-B

Rev. 1.0

9

Table 9. Thermal Characteristics

Parameter

Symbol

Test Condition

Package

Value

Unit

Thermal Resistance

Junction to Ambient



JA

Still Air

10-MSOP

131

°C/W

20-QFN

119

°C/W

Thermal Resistance

Junction to Case



JC

Still Air

20-QFN

16

°C/W

Table 10. Absolute Maximum Ratings1

Parameter

Symbol

Test Condition

Value

Unit

DC Supply Voltage

–0.5 to 3.8

V

Input Voltage

CLKIN, SCL, SDA

–0.5 to 3.8

V

VC

–0.5 to (VDD+0.3)

V

Pins XA, XB

–0.5 to 1.3 V

V

Junction Temperature

–55 to 150

°C

Soldering Temperature (Pb-free

profile)2

260

°C

Soldering Temperature Time at

TPEAK (Pb-free profile)2

20–40

Sec

Notes:

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be

restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

2. The device is compliant with JEDEC J-STD-020.