AM50DL128BH70IS datasheet(9/68 Pages) AMD

Part #	AM50DL128BH70IS

Description	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

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Manufacturer	AMD [Advanced Micro Devices]

Direct Link	http://www.amd.com

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9 / 68 page

October 7, 2003

Am50DL128BH

7

ADV ANCE

I N FO RMAT I O N

CONNECTION DIAGRAM

Special Package Handling Instructions

Special handling is required for Flash Memory products

in molded packages (BGA). The package and/or data

integrity may be compromised if the package body is

exposed to temperatures above 150

°C for prolonged

periods of time.

A1

B1

C1

F1

G1

L1

M1

D2

E2

F2

G2

H2

J2

C3

D3

E3

F3

G3

H3

J3

K3

C4

D4

E4

F4

G4

H4

J4

K4

B5

C5

D5

E5

H5

J5

K5

L5

B6

C6

D6

E6

H6

J6

K6

L6

C7

D7

E7

F7

G7

H7

J7

K7

C8

D8

E8

F8

G8

H8

J8

K8

D9

E9

F9

G9

H9

J9

A10

B10

F10

G10

L10

M10

NC

A3

A2

A1

A0

CE#f1

CE1#s

A7

A6

A5

A4

VSS

OE#

DQ0

DQ8

LB#

UB#

A18

A17

DQ1

DQ9

DQ10

DQ2

NC

WP#/ACC

RESET#

RY/BY#

DQ3

VCCf

DQ11

NC

WE#

CE2s

A20

DQ4

VCCs

NC

A8

A19

A9

A10

DQ6

DQ13

DQ12

DQ5

A11

A12

A13

A14

NC

DQ15/A-1

DQ7

DQ14

A15

A21

CE2#f

A16

CIOf

VSS

NC

Pseudo

SRAM only

Flash 1, 2 and

Pseudo SRAM

shared

Flash 1 and 2

shared

Flash 1 only

Flash 2 only

73-Ball FBGA

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AM50DL128BH70IS Datasheet(PDF) 9 Page - Advanced Micro Devices

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