© 2013 Semiconductor Components Industries, LLC.

www.fairchildsemi.com

FAN48611

• Rev. 1.2

3

www.onsemi.com

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

Voltage on VIN Pin

-0.3

6.0

V

Voltage on VOUT Pin

6.0

V

Voltage on SW Node

DC

-0.3

6.0

V

Transient: 10 ns, 3 MHz

-1.0

8.0

Voltage on Other Pins

-0.3

6.0(2)

V

ESD

Electrostatic Discharge Protection Level

Human Body Model,

ANSI/ESDA/JEDEC JS-001-2012

2

kV

Charged Device Model per

JESD22-C101

2

Junction Temperature

-40

+150

°C

Storage Temperature

-65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

2.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor

does not recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

2.7

4.8

V

Maximum Output Current

350

mA

Ambient Temperature

-40

+85

°C

Junction Temperature

-40

+125

°C

Thermal Properties

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-

layer 2s2p boards with vias in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed

Symbol

Parameter

Typical

Unit

Junction-to-Ambient Thermal Resistance

50

°C/W