DMP3036SFV

Document number: DS39695 Rev. 3 - 2

2 of 7

www.diodes.com

December 2017

© Diodes Incorporated

DMP3036SFV

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

-30

V

Gate-Source Voltage

±25

V

-8.7

-7.0

A

-30

-25

A

Maximum Continuous Body Diode Forward Current (Note 7)

-3.6

A

Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%)

-80

A

Avalanche Current, L = 0.3mH (Note 8)

-17.5

A

Avalanche Energy, L = 0.3mH (Note 8)

64

mJ

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

0.9

W

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

137

°C/W

Total Power Dissipation (Note 6)

2.3

W

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

55

°C/W

Thermal Resistance, Junction to Case (Note 7)

3.5

Operating and Storage Temperature Range

-55 to +150

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 9)

Drain-Source Breakdown Voltage

-30

—

—

V

Zero Gate Voltage Drain Current

—

—

-1

µA

Gate-Source Leakage

—

—

±100

nA

ON CHARACTERISTICS (Note 9)

Gate Threshold Voltage

-1.0

—

-2.5

V

Static Drain-Source On-Resistance

—

—

20

m

Ω

—

—

29

Diode Forward Voltage

—

-0.7

-1.2

V

DYNAMIC CHARACTERISTICS (Note 10)

Input Capacitance

—

1931

—

pF

f = 1.0MHz

Output Capacitance

—

226

—

Reverse Transfer Capacitance

—

168

—

Gate Resistance

—

11

—

Ω

—

8.8

—

nC



—

16.5

—

Gate-Source Charge

—

2.6

—

Gate-Drain Charge

—

3.6

—

Turn-On Delay Time

—

8.2

—

ns

Turn-On Rise Time

—

14

—

Turn-Off Delay Time

—

65

—

Turn-Off Fall Time

—

31.6

—

Reverse Recovery Time

—

9.3

—

ns

Reverse Recovery Charge

—

12.2

—

nC

Notes:

5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.

7. Thermal resistance from junction to soldering point (on the exposed drain pad).

9. Short duration pulse test used to minimize self-heating effect.

10. Guaranteed by design. Not subject to product testing.