VITESSE

SEMICONDUCTOR CORPORATION

G52293-0, Rev 2.3

Page 7

05/07/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Advance Product Information

VSC7124

Quad Port Bypass Circuit

Package Thermal Characteristics

The VSC7124 is packaged in a standard plastic quad flatpack, PQFP. This package adheres to industry-stan-

dard EIAJ footprints for a 10mm body, 44-pin PQFP. The package construction is shown in Figure 4. The 44-

pin PQFP with embedded slug has the thermal properties listed in Table 2.

Figure 4: Package Cross Section

Table 2: 44 PQFP Thermal Resistance

Moisture Sensitivity Level

This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC, 60%

relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.

Symbol

Description

Value

Units

θ

CA-0

Thermal resistance from case-to-ambient, still air

50

θ

CA-100

Thermal resistance from case-to-ambient, 100 LFPM air

43

θ

CA-200

Thermal resistance from case-to-ambient, 200 LFPM air

39

θ

CA-400

Thermal resistance from case-to-ambient, 400 LFPM air

36

θ

CA-600

Thermal resistance from case-to-ambient, 600 LFPM air

34

Die

Plastic Molding Compound

Lead

Bond Wire