© 2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 12/28/16

General Purpose ESD Protection - SPHV Series

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp (T

to peak

3°C/second max

T

3°C/second max

Reflow

- Temperature (T

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Ordering Information

Part Number

Package

Marking

Min. Order Qty.

SPHV12-01ETG

SOD882

U2

10000

SPHV15-01ETG

U5

SPHV24-01ETG

U4

SPHV36-01ETG

U6

SPHV12-01KTG

SOD882

with

side

exposed

leadframe

U2

10000

SPHV15-01KTG

U5

SPHV24-01KTG

U4

SPHV36-01KTG

U6

Product Characteristics

Lead Plating

Pre-Plated Frame

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Substrate material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

Part Numbering System

Part Marking System

T G

Voltage

Number of

Channels

Package

T= Tape & Reel

G= Green

–

TVS Diode Arrays

E: SOD882

x

K: SOD882 with side

exposed leadframe

2: SPHV12

5: SPHV15

4: SPHV24

6: SPHV36

12