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TPS54900PW Datasheet(PDF) 11 Page - Texas Instruments

Part No. TPS54900PW
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com

TPS54900PW Datasheet(HTML) 11 Page - Texas Instruments

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SLVS405 – OCTOBER 2001
component selection
Components were selected to maximize efficiency while maintaining acceptable area, stability, and output
noise. For instance in choosing the free wheeling diodes, both junctions in the SOT–23 package are used in
parallel to save up to 6 mW per channel. The recommended output filter and internal compensation were
selected with the expectation of a 3.3-
µH, 15-µF post filter located at the load (line driver supply input). Use of
one or more ceramic capacitors in place of the 10-
µF tantalum for the output filter can reduce board area at the
cost of increased noise and reduced stability margin. Inductors with smaller mechanical dimensions than those
from GCI or Bourns, such as the Coilcraft, reduce required board area and decrease conversion efficiency up
to 4%. Use of nonshielded inductors may increase efficiency, but add risk of EMI. System level testing should
be performed in qualifying component and layout decisions.
layout considerations
Two portions of the layout are critical and deserve close attention. First, the high frequency input bypass
capacitors (C10 and C11 in the eight channel application circuit diagram) must be placed as close as possible
and routed directly to the TPS54900 VIN and GND pins to minimize trace inductance.
Second, the free wheeling diodes (D1–8 in the eight channel application circuit diagram) must also be placed
as close as possible and routed directly to the TPS54900 LX_ and GND pins. Placing the diodes on the opposite
side of the board as the TPS54900, immediately opposite the TPS54900, facilitates low impedance routing of
the diodes to the appropriate TPS54900 pins. The EVM layout uses this approach.

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