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EMC Datasheet(PDF) 3 Page - TT Electronics.

Part # EMC
Description  Pulse Withstanding Fusible Flameproof Metal Film Resistors
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Manufacturer  TTELEC [TT Electronics.]
Direct Link  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

EMC Datasheet(HTML) 3 Page - TT Electronics.

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Pulse Withstanding Fusible
Flameproof Metal Film Resistors
EMC Series
Application Notes
1.Iftheresistorsaretodissipatefullratedpower,itisrecommendedthattheterminationsshouldnotbesolderedcloserthan4mm
from the body.
2.DuetooperatingtemperaturelimitsimposedbysomePCBmaterials,deratingmaybenecessary.Anestimateofthetemperaturerise
tobeexpectedcanbecalculatedusingthethermalimpedancefiguresgivenunderElectricalData.
3.Toprotectagainstfireunderallconditionsofoverload,apositiveclearanceofatleast13mmshouldbeprovidedbetweenthebodyof
theresistorandanycombustiblematerials.
4.EMCresistorscanalsobesuppliedloosepackedwithradial,goalpostorlancetpre-formedleads,tapepackedwithradialpre-formed
leads,orinZI-formSMDformatpackedinblistertape-seehttp://www.ttelectronics.com/themes/ttelectronics/datasheets/resistors/
ZI-form.pdf
Packaging
OurstandardpackagingforEMCistapedandboxed.ThecriticaldimensionsareshowninFigure1.Thecomponentwireswillnot
protrudebeyondtheoutsideedgeofthetapes.Alternativepackagingisavailablebyrequest.
mm
EMC2
b
68
b
f1
f2
6
6
5
Body location f1 – f2 1.4 mm
Figure 1
03.17
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
http://www.ttelectronics.com/resistors
BI Technologies IRC Welwyn
EMC2RRadialTapedDimensions(mm)
Dimension
Notation Nominal
Tolerance
Component Body Length
L
10.0 Max
Component Body Diameter
D
4.0 Max
Terminal Lead Diameter
d
0.8 Nom
Component Pitch
P
12.7
±0.5
PitchofHoles
Po
12.7
±0.2
DistancebetweenHole&Component
P1
3.85
±0.3
P2
5.85
±0.5
Lead Pitch
F
5.0
+0.75-0.34
WidthofBackingStrip
W
18.0
±0.3
PositionofHole
W1
9.0
±0.25
DiameterofHole
Do
4.0
±0.3
HeighttoLeadForm
Ho
16.0
±0.3
HeightfromLeadForm
Ho1
21.7 Max
HeighttoResistor
Ho2
18.0 Max
Width of Adhesive Tape
W2
15.0
±0.5
Length of protrusion
l
<2.5
Form Dimensions
K1
2.0
±0.3
K2
3.0
±0.5
K3
1.5
±0.25
K4
1.0
±0.2
Also a 2W radial taped version is available as shown below
Application Notes
Application Notes
1. If the resistors are to dissipate full rated power, it is recommended that the terminations should not be soldered closer than
4mm from the body.
2. Due to operating temperature limits imposed by some PCB materials, derating may be necessary. An estimate of the
temperature rise to be expected at the center of the body can be calculated using the thermal impedance figures given under
Electrical Data.
3. For the purpose of UL approval, the following points should be observed:
3.1 To protect against fire under all conditions of overload, a positive clearance of at least 13mm should be provided
between the body of the resistor and any combustible materials.
3.2 A positive clearance of 13mm should be provided between the resistor body or terminations and uninsulated parts of
opposite polarity or uninsulated dead metal parts.
3.3 Limited Short Circuit testing should be performed in the complete appliance.
4. ULW resistors can also be supplied with radial, goalpost or lancet pre-formed leads. In particular ULW2, ULW3, ULW4 and
ULW5 are available in ZI-form SMD format packed in blister tape – see
http://www.ttelectronics.com/sites/default/files/resistors-datasheets/ZI-form.pdf
Also a 2W radial taped version* is available as shown below.
*Although body dimensions differ slightly, ULWP2R Performance and Electrical Data are identical to those of ULW2
ULWP2R Radial Taped Dimensions (mm)
Dimension
Notation Nominal
Tolerance
Component Body Length
L
10.0 Max
Component Body Diameter
D
4.0 Max
Terminal Lead Diameter
d
0.8 Nom
Component Pitch
P
5
±0.5
Pitch of Holes
Po
10
±0.2
Distance between Hole &
Component
P1
3.85
±0.3
P2
5.85
±0.5
Lead Pitch
F
5.0
+0.75 -0.34
Width of Backing Strip
W
18.0
±0.3
Position of Hole
W1
9.0
±0.25
Diameter of Hole
Do
4.0
±0.3
Height to Lead Form
Ho
16.0
±0.3
Height from Lead Form
Ho1
17.0 MAX
Height to Resistor
Ho2
18.0 MIN
Width of Adhesive Tape
W2
15.0
±0.5
Length of protrusion
l
<2.5
Form Dimensions
K1
2.0
±0.3
K2
3.0
±0.5
K3
1.5
±0.25
K4
1.0
±0.2
(Delete redundant subtitle)
(This diagram exists on WP-S,
so just copy it)


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