Metal Glaze™ Cylindrical

Official Size Power Resistor

CHP1X Series

0.1 ohm to 10K ohm

Outstanding surge capacity

1W in a 1/2W package (2010 footprint)

150°C maximum operating temperature

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

element fired at 1000°C to

solid ceramic substrate

High temperature

dielectric coating

60/40 Solder over

nickel barrier

High Purity ceramic

core for optimal

thermal

distribution

Metal Glaze™ Cylindrical

Official Size

Power Resistor

CHP1X Series

Environmental Data

Characteristics

Maximum Change

Test Method

Temperature Coefficient

As specified

MIL-R-55342E Par 4.7.9 (-55°C + 125°C)

Thermal Shock

±0.5% + 0.01 ohm

MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)

Low Temperature Operation

±0.25% + 0.01 ohm

MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)

Short Time Overload

±0.5% + 0.01 ohm

±1% for R>100K ohm

MIL-R-55342E Par 4.7.5

2.5 x P x R for 5 seconds

High Temperature Exposure

±0.5% + 0.01 ohm

MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)

Resistance to Bonding Exposure

±0.25% + 0.01 ohm

MIL-R-55342E Par 4.7.7 (Reflow soldered to board at

260°C for 10 seconds)

Solderability

95% minimum coverage

MIL-STD-202, Method 208 (245°C for 5 seconds)

Moisture Resistance

±0.5% + 0.01 ohm

MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)

Life Test

±0.3% + 0.01 ohm

MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)

Terminal Adhesion Strength

±1% + 0.01 ohm

no mechanical damage

1200 gram push from underside of mounted chip for

60 seconds

Resistance to Board Bending

±1% + 0.01 ohm

no mechanical damage

Chip mounted in center of 90mm long board, deflected

5mm so as to exert pull on chip contacts for 10 seconds

√

CHP1X Series Issue September 2008 Sheet 1 of 2

2

element fired at 1000˚C to

solid ceramic substrate

High temperature

dielectric coating

60/40 Solder over

nickel barrier

High Purity ceramic

core for optimal

thermal

distribution

Resistors

All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)

BI Technologies IRC Welwyn

07.14

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors