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CHP1X-50-2203-F-7 Datasheet(PDF) 1 Page - TT Electronics. |
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CHP1X-50-2203-F-7 Datasheet(HTML) 1 Page - TT Electronics. |
1 / 2 page Metal Glaze™ Cylindrical Official Size Power Resistor CHP1X Series 0.1 ohm to 10K ohm Outstanding surge capacity 1W in a 1/2W package (2010 footprint) 150°C maximum operating temperature General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate High temperature dielectric coating 60/40 Solder over nickel barrier High Purity ceramic core for optimal thermal distribution Metal Glaze™ Cylindrical Official Size Power Resistor CHP1X Series • 0.1 ohm to 10K ohm • Outstanding surge capacity • 1W in a 1/2W package (2010 footprint) • 150°C maximum operating temperature Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Life Test ±0.3% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds Resistance to Board Bending ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds √ CHP1X Series Issue September 2008 Sheet 1 of 2 2 Metal Glaze™ thick film element fired at 1000˚C to solid ceramic substrate High temperature dielectric coating 60/40 Solder over nickel barrier High Purity ceramic core for optimal thermal distribution Resistors All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2) BI Technologies IRC Welwyn 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors |
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