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SLG59H1017V Datasheet(PDF) 33 Page - Dialog Semiconductor |
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SLG59H1017V Datasheet(HTML) 33 Page - Dialog Semiconductor |
33 / 34 page 000-0059H1017-101 Page 33 of 34 SLG59H1017V Tape and Reel Specifications Carrier Tape Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 2.64 mm3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Max Units Reel & Hub Size [mm] Leader (min) Trailer (min) Tape Width [mm] Part Pitch [mm] per Reel per Box Pockets Length [mm] Pockets Length [mm] STQFN 18L 0.4P FC Green 18 1.6 x 3 x 0.55 3,000 3,000 178 / 60 100 400 100 400 8 4 Package Type PocketBTM Length PocketBTM Width Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole to Tape Edge Index Hole to Pocket Center Tape Width A0 B0 K0 P0 P1 D0 E F W STQFN 18L 0.4P FC Green 1.78 3.18 0.76 4 4 1.5 1.75 3.5 8 Refer to EIA-481 specification |
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