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TPS254900AIRVCRQ1 Datasheet(PDF) 31 Page - Texas Instruments |
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TPS254900AIRVCRQ1 Datasheet(HTML) 31 Page - Texas Instruments |
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31 / 39 page  31 TPS254900A-Q1 www.ti.com SLUSCU5A – NOVEMBER 2017 – REVISED JANUARY 2018 Product Folder Links: TPS254900A-Q1 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Layout Guidelines (continued) – The whole path from OUT to GND or BIAS to GND across the TVS should be as short as possible. • DP_IN, DM_IN, DP_OUT, and DM_OUT routing considerations – Route these traces as microstrips with nominal differential impedance of 90 Ω. – Minimize the use of vias on the high-speed data lines. – Keep the reference GND plane devoid from cuts or splits above the differential pairs to prevent impedance discontinuities. – For more USB 2.0 high-speed D+ and D– differential routing information, see the High Speed USB Platform Design Guideline from Intel. • Thermal Considerations – When properly mounted, the thermal-pad package provides significantly greater cooling ability than an ordinary package. To operate at rated power, the thermal pad must be soldered to the board GND plane directly under the device. The thermal pad is at GND potential and can be connected using multiple vias to inner-layer GND. Other planes, such as the bottom side of the circuit board, can be used to increase heat sinking in higher-current applications. See the PowerPad™ Thermally Enhanced Package application report (SLMA002) and PowerPAD™ Made Easy application brief (SLMA004) for more information on using this thermal pad package. |
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