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TPS254900A-Q1 Datasheet(PDF) 31 Page - Texas Instruments

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Part No. TPS254900A-Q1
Description  Automotive USB Host Charger With Short-to-VBATT Protection
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
Logo TI1 - Texas Instruments

TPS254900A-Q1 Datasheet(HTML) 31 Page - Texas Instruments

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TPS254900A-Q1
www.ti.com
SLUSCU5A ? NOVEMBER 2017 ? REVISED JANUARY 2018
Product Folder Links: TPS254900A-Q1
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Copyright © 2017?2018, Texas Instruments Incorporated
Layout Guidelines (continued)
?
The whole path from OUT to GND or BIAS to GND across the TVS should be as short as possible.
?
DP_IN, DM_IN, DP_OUT, and DM_OUT routing considerations
?
Route these traces as microstrips with nominal differential impedance of 90 ?.
?
Minimize the use of vias on the high-speed data lines.
?
Keep the reference GND plane devoid from cuts or splits above the differential pairs to prevent impedance
discontinuities.
?
For more USB 2.0 high-speed D+ and D? differential routing information, see the High Speed USB
Platform Design Guideline from Intel.
?
Thermal Considerations
?
When properly mounted, the thermal-pad package provides significantly greater cooling ability than an
ordinary package. To operate at rated power, the thermal pad must be soldered to the board GND plane
directly under the device. The thermal pad is at GND potential and can be connected using multiple vias
to inner-layer GND. Other planes, such as the bottom side of the circuit board, can be used to increase
heat sinking in higher-current applications. See the PowerPad? Thermally Enhanced Package application
report (SLMA002) and PowerPAD? Made Easy application brief (SLMA004) for more information on
using this thermal pad package.


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