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PTCTZ3MR200KTT Datasheet(PDF) 2 Page - Vishay Siliconix |
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PTCTZ3MR200KTT Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 3 page PTCTZ www.vishay.com Vishay BCcomponents Revision: 27-Nov-15 2 Document Number: 29068 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PTC OUTLINES DIMENSIONS in millimeters DIMENSIONS OF SOLDER LANDS in millimeters SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes which can be used are reflow (infrared and convection heating) and vapor phase. The maximum temperature of 260 °C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. MOUNTING CONDITIONS A flat pick-up area of minimum 10 mm2 and low weight allows for fast placement. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behavior at high temperatures. Handling forces applied to the component should be limited to 5 N in any condition. PTC SMD ceramic size: 6.5 mm 3.6 ± 0.1 10 ± 0.25 8.0 2.8 2 4 ± 0.1 4 ± 0.2 0.2 10° max. 1 7.6 ± 0.25 3.45 ± 0.15 1.2 7.3 0 - 0.2 0.6 + 0.6 0 3 2 2 3 1 11 5 2 PACKAGING TYPE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER PTCTZ 1500 PS conductive blister tape acc. IEC60286-3 16 mm 12 mm 330 mm MATERIAL INFORMATION REF. DESCRIPTION MATERIAL AND REMARKS 1 Ceramic BaTiO3 doped 2 Metalization NiCr Ag layer (vacuum deposition) 3 Lead frame Ni plated phosphor bronze material covered by matte tin layer 0 50 100 150 200 250 300 250 200 150 100 50 0 t (s) 215 °C 180 °C 20 s to 40 s Internal preheating, e.g. by infrared, max. 2 K/s 100 °C 130 °C External preheating Forced cooling T (°C) Typical values (solid line) Process limits (dotted lines) Vapor phase soldering Reflow soldering 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 260 °C t (s) 215 °C 180 °C 10 s 40 s 2 K/s T (°C) 245 °C 130 °C Typical values (solid line) Process limits (dotted lines) |
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