DMN7022LFGQ

Document number: DS39840 Rev. 2 - 2

2 of 6

www.diodes.com

August 2017

© Diodes Incorporated

DMN7022LFGQ

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

75

V

Gate-Source Voltage

±20

V

Steady

State

7.8

6.2

A

Steady

State

23

18

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

56

A

Maximum Continuous Body Diode Forward Current (Note 6)

2.1

A

Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)

50

A

Avalanche Current, L = 0.1mH (Note 9)

28.8

A

Avalanche Energy, L = 0.1mH (Note 9)

42.2

mJ

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 6)

0.9

W

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

125

°C/W

t<10s

67

Total Power Dissipation (Note 7)

2

W

Thermal Resistance, Junction to Ambient (Note 7)

Steady State

62

°C/W

t<10s

34

Thermal Resistance, Junction to Case (Note 8)

6.9

Operating and Storage Temperature Range

-55 to +150

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 10)

Drain-Source Breakdown Voltage

75

—

—

V

—

—

1

µA

Gate-Source Leakage

—

—

±100

nA

ON CHARACTERISTICS (Note 10)

Gate Threshold Voltage

1

—

3

V

Static Drain-Source On-Resistance

—

14.6

22

m

Ω

—

20.5

28

Diode Forward Voltage

—

0.72

—

V

DYNAMIC CHARACTERISTICS (Note 11)

Input Capacitance

—

2737

—

pF

f = 1MHz

Output Capacitance

—

126

—

pF

Reverse Transfer Capacitance

—

96.1

—

pF

Gate Resistance

—

0.89

—

Ω

—

26.4

—

nC

—

56.5

—

nC

Gate-Source Charge

—

12

—

nC

Gate-Drain Charge

—

11.8

—

nC

Turn-On Delay Time

—

6.1

—

ns

Turn-On Rise Time

—

5.7

—

ns

Turn-Off Delay Time

—

19.6

—

ns

Turn-Off Fall Time

—

3.9

—

ns

Body Diode Reverse Recovery Time

—



26.2

—



ns

Body Diode Reverse Recovery Charge

—



25.2

—



nC

Notes:

6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.

7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.

8. Thermal resistance from junction to soldering point (on the exposed drain pad).

10. Short duration pulse test used to minimize self-heating effect.

11. Guaranteed by design. Not subject to product testing.