K4C89083AF-GIFB datasheet(2/55 Pages) SAMSUNG

Part #	K4C89083AF-GIFB

Description	288Mb x18 Network-DRAM2 Specification

Download	55 Pages

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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K4C89183AF

- 2 -

REV. 0.7 Jan. 2005

Revision History

Version 0.0 (Oct. 2002)

- First Release

Version 0.01 (Nov. 2002)

- Changed die revision from D-die to F-die

- Corrected typo

- Corrected DQS to DS and QS(DQS -> DS and QS) in AC timing table and timing diagram.

Version 0.1 (Apr. 2003)

- Added 800Mbps(400Mhz) product

- Changed operating temperature from Ta to Tc.

- Changed capacitance of ADDR/CMD/CLK

- Changed tDSS(DS input Falling Edge to Clock Setup Time)

- Added CL7 for 800Mbps

- Deleted TSOP package outline

Version 0.11 (Apr. 2003)

- Corrected typo in page 3.(Deleted bi-directional strobe)

- Corrected min. Vref to VDDQ/2x95% in page 7

Version 0.2 (Aug. 2003)

- Added package physical dimension

- Extracted 800Mbps(G7) binning from target spec ( G7 will be added in the future)

- Changed DC test condition

- Changed low frequency spec like below

- Changed AC test load picture

Version 0.3 (Nov. 2003)

- Changed Packge type from die-exposed to full molded

- Changed Package code in Partnumber

From

To

Min

Max

Min

Max

Addr/CMD/CLK

1.5

2.5

1.5

3.0

From

To

F6

FB

F5

G7

F6

FB

F5

CL4

0.9

1.0

0.75

0.8

1.0

CL5

0.9

1.0

0.75

0.8

1.0

CL6

0.9

1.0

0.75

0.8

1.0

CL7

-

0.75

-

From

To

Changed point

IDD1S,IDD2N,IDD2P,IDD5,IDD6

IDD1S,IDD2N,IDD2P,IDD5B,IDD6

Changed condition

-

IDD4W, IDD4R

newly inserted

From

To

Unit : ns

F6

FB

F5

F6

FB

F5

tCK max@CL=4

7.5

6.0

tCK max@CL=5

7.5

6.0

tCK max@CL=6

7.5

6.0

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