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SLG46826 Datasheet(PDF) 3 Page - Dialog Semiconductor

Part # SLG46826
Description  Two High Speed General Purpose Rail-to-Rail Analog
Download  165 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

SLG46826 Datasheet(HTML) 3 Page - Dialog Semiconductor

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Datasheet
31-Jan-2018
CFR0011-120-01
Revision 2.4
3 of 165
© 2018 Dialog Semiconductor
SLG46826
GreenPAK Programmable Mixed Signal Matrix with In-System
Programmability
PRELIMINARY
14.1 General Operation ..............................................................................................................................................94
14.2 POR Sequence ..................................................................................................................................................95
14.3 Macrocells Output States During POR Sequence .............................................................................................95
15 I2C Serial Communications Macrocell ...........................................................................................................................98
15.1 I2C Serial Communications Macrocell Overview ...............................................................................................98
15.2 I2C Serial Communications Device Addressing .................................................................................................98
15.3 I2C Serial General Timing ..................................................................................................................................99
15.4 I2C Serial Communications Commands ............................................................................................................99
15.5 Chip Configuration Data Protection ..................................................................................................................101
16 NVM with a Software Write Protection 2-Kbit ..............................................................................................................106
16.1 Serial NVM Write Operations ...........................................................................................................................106
16.2 Serial NVM Read Operations ...........................................................................................................................107
16.3 Serial NVM Erase Operations ..........................................................................................................................107
16.4 Acknowledge Polling ........................................................................................................................................108
16.5 Low power standby mode ................................................................................................................................108
16.6 Emulated EEPROM Write Protection ...............................................................................................................108
17 Analog Temperature Sensor .........................................................................................................................................110
18 Register Definitions .......................................................................................................................................................112
19 Package Top Marking System Definition .....................................................................................................................155
19.1 STQFN 20L 2x3mm 0.4P FCD Package ........................................................................................................155
19.2 TSSOP-20 .......................................................................................................................................................155
20 Package Information ......................................................................................................................................................156
20.1 Package outlines for STQFN 20L 2x3mm 0.4P FCD .......................................................................................156
20.2 Package outlines for TSSOP 20L 173 MIL Green ..........................................................................................157
21 STQFN and TSSOP Handling ........................................................................................................................................158
22 Soldering Information ....................................................................................................................................................158
23 Ordering Information .....................................................................................................................................................158
23.1 Tape and Reel Specifications ..........................................................................................................................158
23.2 Carrier Tape Drawing and Dimensions ............................................................................................................158
23.3 STQFN-20L ......................................................................................................................................................159
23.4 TSSOP-20L ......................................................................................................................................................159
24 Layout Guidelines ..........................................................................................................................................................160
24.1 STQFN 20L 2x3mm 0.4P FCD Package .........................................................................................................160
24.2 TSSOP-20 ........................................................................................................................................................161


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