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SLG59M1639V Datasheet(PDF) 10 Page - Dialog Semiconductor |
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SLG59M1639V Datasheet(HTML) 10 Page - Dialog Semiconductor |
10 / 11 page 000-0059M1639-106 Page 10 of 11 SLG59M1639V Tape and Reel Specifications Carrier Tape Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.88 mm3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Max Units Reel & Hub Size [mm] Leader (min) Trailer (min) Tape Width [mm] Part Pitch [mm] per Reel per Box Pockets Length [mm] Pockets Length [mm] STDFN 8L 1x1.6mm 0.4P FCD Green 8 1.0 x 1.6 x 0.55 3,000 3,000 178 / 60 100 400 100 400 8 4 Package Type PocketBTM Length PocketBTM Width Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole to Tape Edge Index Hole to Pocket Center Tape Width A0 B0 K0 P0 P1 D0 E F W STDFN 8L 1x1.6mm 0.4P FCD Green 1.12 1.72 0.7 4 4 1.55 1.75 3.5 8 |
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