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SLG7NT4180 Datasheet(PDF) 8 Page - Dialog Semiconductor |
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SLG7NT4180 Datasheet(HTML) 8 Page - Dialog Semiconductor |
8 / 10 page Logic Gates SLG7NT4180 SLG7NT4180_r100 Page 8 Tape and Reel Specification Package Type # of Pins Nominal Package Size (mm) Max Units Reel & Hub Size (mm) Trailer A Leader B Pocket (mm) per reel per box Pockets Length (mm) Pockets Length (mm) Width Pitch TDFN 12L 2.5x2.5mm 0.4P Green 12 2.5x2.5x0.75 3000 3000 178/60 42 168 42 168 8 4 Carrier Tape Drawing and Dimensions Package Type Pocket BTM Length (mm) Pocket BTM Width (mm) Pocket Depth (mm) Index Hole Pitch (mm) Pocket Pitch (mm) Index Hole Diameter (mm) Index Hole to Tape Edge (mm) Index Hole to Pocket Center (mm) Tape Width (mm) A0 B0 K0 P0 P1 D0 E F W TDFN 12L 2.5x2.5mm 0.4P Green 2.75 2.75 1.05 4 4 1.55 1.75 3.5 8 Refer to EIA-481 Specifications Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 4.6875 mm 3 (nominal). More information can be found at www.jedec.org. |
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