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NE678M04 Datasheet(PDF) 2 Page - NEC |
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NE678M04 Datasheet(HTML) 2 Page - NEC |
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2 / 7 page 
Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 1.08cm2 x 1.0 mm thick glass epoxy PCB. SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 9.0 VCEO Collector to Emitter Voltage V 6.0 VEBO Emitter to Base Voltage V 2.0 IC Collector Current mA 100 PT Total Power Dissipation2 mW 205 TJ Junction Temperature °C 150 TSTG Storage Temperature °C -65 to +150 ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) PART NUMBER QUANTITY NE678M04-T2 3k pcs./reel ORDERING INFORMATION SYMBOLS PARAMETERS UNITS RATINGS Rth j-a Thermal Resistance from °C/W 600 Junction to Ambient THERMAL RESISTANCE Note: 1. Mounted on a 1.08cm2 x 1.0 mm thick glass epoxy PCB. TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE DC CURRENT GAIN vs. COLLECTOR CURRENT REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE TYPICAL PERFORMANCE CURVES (TA = 25 °C) NE678M04 300 250 200 205 150 100 50 0 25 50 75 100 125 150 Mounted on Glass Epoxy PCB (1.08 cm 2 x 1.0 mm (t) ) 1.0 f= 1 MHz 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 5 6 100 90 80 70 60 50 40 30 20 10 02 4 6 8 700 µA 600 µA 500 µA 400 µA 300 µA 200 µA IB =100 µA 1000 VCE = 3 V 100 10 0.1 1 10 100 Ambient Temperature TA (ºC) Collector to Base Voltage VCB (V) Collector to Emitter Voltage VCE (V) Collector Current IC (mA) |
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