ATBTLC1000-MR110CA [DATASHEET]

Atmel-42514E-ATBTLC1000-MR110CA-BLE-Module_Datasheet_08/2016

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Reflow Profile Information

This chapter provides guidelines for reflow processes in getting the Atmel module soldered to the customer’s

design.

12.1 Storage Condition

12.1.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.

The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.

12.1.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, <30%.

12.2 Stencil Design

The recommended stencil is laser-cut, stainless-steel type with a thickness of 100µm to 130µm, and approximately

a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper with bottom opening

25µm larger than the top can be utilized. Local manufacturing experience may find other combinations of stencil

thickness and aperture size to get good results.

12.3 Baking Conditions

This module is rated at MSL level 3. After the sealed bag is opened, no baking is required within 168 hours so long

as the devices are held at ≤30°C/60% RH or stored at <10% RH.

The module will require baking before mounting if:



The sealed bag has been open for >168 hours



Humidity Indicator Card reads >10%



SIPs need to be baked for 8 hours at 125°C

12.4 Soldering and Reflow Condition

12.4.1 Reflow Oven

It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen atmosphere be

used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability and reduce temperature

gradient across the board. It can also enhance the appearance of the solder joints by reducing the effects of

oxidation.

The following bullet items should also be observed in the reflow process:



Sn/3.8 Ag/0.7 Cu or SENJU N705-GRN3360-K2-V Type 3, no clean paste.



Allowable reflow soldering times: Three times based on the following reflow soldering profile (see Figure 12-

1).



Temperature profile: Reflow soldering shall be done according to the following temperature profile (see

Figure 12-1).



Peak temp: 250°C.