CDCM6208V2RGZT datasheet(7/92 Pages) TI1 | 2:8 Clock Generator, Jitter Cleaner With Fractional Dividers

Part #	CDCM6208V2RGZT

Description	2:8 Clock Generator, Jitter Cleaner With Fractional Dividers

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Manufacturer	TI1 [Texas Instruments]

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7

CDCM6208

www.ti.com

SCAS931G – MAY 2012 – REVISED JANUARY 2018

Product Folder Links: CDCM6208

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(1)

For fast power up ramps under 50 ms and when all supply pins are driven from the same power supply source, PDN can be left floating.

For slower power-up ramps or if supply pins are sequenced with uncertain time delays, PDN needs to be held low until DVDD,

VDD_PLLx, and VDD_PRI/SEC reach at least 1.45-V supply voltage. See application section on mixing power supplies and particularly

Figure 59 for details.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD_Yx_Yy

Output supply voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_PLL1,

VDD_PLL2

Core analog supply voltage

1.71

1.8/2.5/3.3

3.465

V

DVDD

Core digital supply voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_PRI,

VDD_SEC

Reference input supply voltage

1.71

1.8/2.5/3.3

3.465

V

ΔVDD/Δt

VDD power-up ramp time (0 to 3.3 V) PDN left open,

all VDD tight together PDN low-high is delayed (1)

50 < tPDN

ms

TA

Ambient Temperature

–40

85

°C

SDA and SCL in I2C Mode (SI_MODE[1:0] = 01)

VI

Input voltage

DVDD = 1.8 V

–0.5

2.45

V

DVDD = 3.3 V

–0.5

3.965

V

dR

Data rate

100

400

kbps

VIH

High-level input voltage

0.7 × DVDD

V

VIL

Low-level input voltage

0.3 × DVDD

V

CBUS_I2C

Total capacitive load for each bus line

400

pF

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

(2)

The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(3)

Connected to GND with 36 thermal vias (0.3-mm diameter).

(4)

θJB (junction to board) is used for the VQFN package, the main heat flow is from the junction to the GND pad of the VQFN.

6.4 Thermal Information, Airflow = 0 LFM

(1) (2) (3) (4)

THERMAL METRIC(1)

CDCM6208

UNIT

RGZ (VQFN)

48 PINS

RθJA

Junction-to-ambient thermal resistance

30.27

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

16.58

°C/W

RθJB

Junction-to-board thermal resistance

6.83

°C/W

ψJT

Junction-to-top characterization parameter

0.23

°C/W

ψJB

Junction-to-board characterization parameter

6.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.06

°C/W

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