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CDCM6208 Datasheet(PDF) 10 Page - Texas Instruments

Part # CDCM6208
Description  2:8 Clock Generator, Jitter Cleaner With Fractional Dividers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM6208 Datasheet(HTML) 10 Page - Texas Instruments

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10
CDCM6208
SCAS931G – MAY 2012 – REVISED JANUARY 2018
www.ti.com
Product Folder Links: CDCM6208
Submit Documentation Feedback
Copyright © 2012–2018, Texas Instruments Incorporated
6.10
Differential Input Characteristics (PRI_REF, SEC_REF)
VDD_PRI, VDD_SEC = 1.71 V to 1.89 V, 2.375 V to 2.625 V, 3.135 V to 3.465 V, TA = –40°C to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fIN
Reference and bypass input
frequency
0.008
250
MHz
VI
Differential input voltage swing,
peak-to-peak
VDD_PRI/SEC = 2.5/3.3 V
0.2
1.6
VPP
VDD_PRI/SEC = 1.8 V
0.2
1
VPP
VICM
Input common-mode voltage
CML input signaling, R4[7:6] = 00
VDD_PRI/
VDD_SEC
-0.4
VDD_PRI/
VDD_SEC
-0.1
V
VICM
Input common-mode voltage
LVDS, VDD_PRI/SEC
= 1.8/2.5/3.3 V,
R4[7:6] = 01, R4.1 = d.c.,
R4.0 = d.c.
0.8
1.2
1.5
V
VHYST
Input hysteresis
LVDS (Q4[7:6,4:3] = 01)
15
65
mVpp
CML (Q4[7:6,4:3] = 00)
20
85
mVpp
IIH
Input high current
VDD_PRI/SEC = 3.465 V,
VIH = 3.465 V
30
µA
IIL
Input low current
VDD_PRI/SEC = 3.465V, VIL = 0 V
–30
µA
ΔV/ΔT
Reference input edge rate
20% – 80%
0.75
V/ns
IDCDIFF
Reference input duty cycle
30%
70%
CIN
Input capacitance
2.7
pF
(1)
Verified with crystals specified for a load capacitance of CL = 8 pF, the PCB related capacitive load was estimated to be 2.3 pF, and
completed with a load capacitors of 4 pF on each crystal pin connected to GND. XTALs tested: NX3225GA 10MHz EXS00A-CG02813
CRG, NX3225GA 19.44MHz EXS00A-CG02810 CRG, NX3225GA 25MHz EXS00A-CG02811 CRG, and NX3225GA 30.72MHz
EXS00A-CG02812 CRG.
(2)
For 30.73 MHz to 50 MHz, TI recommends to verify sufficient negative resistance and initial frequency accuracy with the crystal vendor.
The 50-MHz use case was verified with a NX3225GA 50MHz EXS00A-CG02814 CRG. To meet a minimum frequency error, the best
choice of the XTAL was one with CL = 7 pF instead of CL = 8 pF.
(3)
With NX3225GA_10M the measured remaining negative resistance on the EVM is 6430 Ω (43 x margin)
(4)
With NX3225GA_25M the measured remaining negative resistance on the EVM is 1740 Ω (25 x margin)
(5)
With NX3225GA_50M the measured remaining negative resistance on the EVM is 350 Ω (11 x margin)
(6)
Maximum drive level measured was 145 µW; XTAL should at least tolerate 200 µW
6.11
Crystal Input Characteristics (SEC_REF)
VDD_SEC = 1.71 to 1.89 V, 2.375 V to 2.625 V, 3.135 V to 3.465 V, TA = –40°C to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Mode of oscillation
Fundamental
Frequency
See note (1)
10
30.72
MHz
See note (2)
30.73
50
MHz
Equivalent Series Resistance (ESR)
10 MHz
150(3)
Ω
25 MHz
70(4)
50 MHz
30(5)
On-chip load capacitance
1.8-V / 3.3-V SEC_REFP
3.5
4.5
5.5
pF
1.8-V SEC_REFN
5.5
7.25
8.5
3.3-V SEC_REFN
6.5
7.34
8.5
Drive level
See note (6)
200
µW


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