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CDCM6208 Datasheet(PDF) 8 Page - Texas Instruments

Part # CDCM6208
Description  2:8 Clock Generator, Jitter Cleaner With Fractional Dividers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM6208 Datasheet(HTML) 8 Page - Texas Instruments

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CDCM6208
SCAS931G – MAY 2012 – REVISED JANUARY 2018
www.ti.com
Product Folder Links: CDCM6208
Submit Documentation Feedback
Copyright © 2012–2018, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3-mm diameter).
(4)
θJB (junction to board) is used for the VQFN package, the main heat flow is from the junction to the GND pad of the VQFN.
6.5 Thermal Information, Airflow = 150 LFM
(1) (2) (3) (4)
THERMAL METRIC(1)
CDCM6208
UNIT
RGZ (VQFN)
48 PINS
RθJA
Junction-to-ambient thermal resistance
21.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
°C/W
RθJB
Junction-to-board thermal resistance
6.61
°C/W
ψJT
Junction-to-top characterization parameter
0.37
°C/W
ψJB
Junction-to-board characterization parameter
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.06
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3-mm diameter).
(4)
θJB (junction to board) is used for the VQFN package, the main heat flow is from the junction to the GND pad of the VQFN.
6.6 Thermal Information, Airflow = 250 LFM
(1) (2) (3) (4)
THERMAL METRIC(1)
CDCM6208
UNIT
RGZ (VQFN)
48 PINS
RθJA
Junction-to-ambient thermal resistance
19.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
°C/W
RθJB
Junction-to-board thermal resistance
6.6
°C/W
ψJT
Junction-to-top characterization parameter
0.45
°C/W
ψJB
Junction-to-board characterization parameter
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.06
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3-mm diameter).
(4)
θJB (junction to board) is used for the VQFN package, the main heat flow is from the junction to the GND pad of the VQFN.
6.7 Thermal Information, Airflow = 500 LFM
(1) (2) (3) (4)
THERMAL METRIC(1)
CDCM6208
UNIT
RGZ (VQFN)
48 PINS
RθJA
Junction-to-ambient thermal resistance
17.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
°C/W
RθJB
Junction-to-board thermal resistance
6.58
°C/W
ψJT
Junction-to-top characterization parameter
0.58
°C/W
ψJB
Junction-to-board characterization parameter
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.05
°C/W


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