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DRV5011ADDBZR Datasheet(PDF) 4 Page - Texas Instruments |
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DRV5011ADDBZR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 DRV5011 SLVSCY6 – DECEMBER 2017 www.ti.com Product Folder Links: DRV5011 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Device-sourced current is negative. Device-sunk current is positive. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Power supply voltage VCC 2.5 5.5 V VO Output voltage OUT 0 VCC V IO Output current(1) OUT –5 20 mA TJ Operating junction temperature 140 °C TA Operating ambient temperature –40 135 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) DRV5011 UNIT SOT-23 (DBZ) X2SON (DMR) 3 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 356 159 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128 77 °C/W RθJB Junction-to-board thermal resistance 94 102 °C/W ψJT Junction-to-top characterization parameter 11.4 0.9 °C/W ψJB Junction-to-board characterization parameter 92 100 °C/W 6.5 Electrical Characteristics for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ICC Operating supply current 2.3 3 mA tON Power-on time (see Figure 10) 40 70 µs td Propagation delay time From change in B to change in OUT 13 25 µs VOH High-level output voltage IO = –1 mA VCC – 0.35 VCC – 0.1 V VOL Low-level output voltage IO = 20 mA 0.15 0.4 V 6.6 Magnetic Characteristics for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fBW Sensing bandwidth 30 kHz BOP Magnetic threshold operate point (see Figure 8) 0.6 2 3.8 mT BRP Magnetic threshold release point (see Figure 8) –3.8 –2 –0.6 mT BHYS Magnetic hysteresis: |BOP – BRP| 2 4 6 mT |
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