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BQ25122YFPT Datasheet(PDF) 7 Page - Texas Instruments |
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BQ25122YFPT Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 70 page  7 bq25122 www.ti.com SLUSD33 – NOVEMBER 2017 Product Folder Links: bq25122 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) bq25122 UNIT YFP (DSBGA) 25 PINS RθJA Junction-to-ambient thermal resistance 60 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.3 °C/W RθJB Junction-to-board thermal resistance 12.0 °C/W ψJT Junction-to-top characterization parameter 1.2 °C/W ψJB Junction-to-board characterization parameter 12.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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