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ATBTLC1000XR Datasheet(PDF) 63 Page - Microchip Technology |
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ATBTLC1000XR Datasheet(HTML) 63 Page - Microchip Technology |
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63 / 78 page  have a grid of ground vias solidly connecting the pad to the inner layer ground plane (one via per exposed center ground pads J41~J49). Dedicate one layer as a ground plane, preferably the second layer from the top. Make sure that this ground plane does not get broken up by routes. Power can route on all layers except the ground layer. Power supply routes should be heavy copper fill planes to ensure the lowest possible inductance. The power pins of the ATBTLC1000-XR1100A should have a via directly to the power plane as close to the pin as possible. Decoupling capacitors should have a via right next to the capacitor pin and this via should go directly down to the power plane – that is to say, the capacitor should not route to the power plane through a long trace. The ground side of the decoupling capacitor should have a via right next to the pad which goes directly down to the ground plane. Each decoupling capacitor should have its own via directly to the ground plane and directly to the power plane right next to the pad. The decoupling capacitors should be placed as close to the pin that it is filtering as possible. 14.1.2 Antenna When designing in the ATBTLC1000-XR1100A, it is important to pay attention to the following recommendations for antenna placement: 1. Make sure to choose an antenna that covers the proper frequency band; 2.400GHz to 2.500GHz. 2. Assure that the antenna is designed matched to 50Ω input impedance. 3. Talk to the antenna vendor and make sure it is understood that the full frequency range must be covered by the antenna. 4. Be sure to follow the antenna vendors best practice layout recommendations when placing the antenna in the customer PCB design. 5. The customer PCB pad that the antenna is connected to must be properly designed for 50Ω impedance. 6. Make sure that the trace from the RF pin on the ATBTLC1000-XR1100A to the antenna matching circuitry has a 50Ω impedance. 7. Do not enclose the antenna within a metal shield. 8. Keep any components that may radiate noise or signals within the 2.4GHz – 2.5GHz frequency band far away from the antenna and RF traces or better yet, shield the noisy components. Any noise radiated from the customer PCB in this frequency band will degrade the sensitivity of the ATBTLC1000-XR1100A device. ATBTLC1000XR/ZR © 2017 Microchip Technology Inc. Datasheet Complete DS60001505A-page 63 |
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