I27120 rev. D 02/03

3

50MT060WH

www.irf.com

Thermal- Mechanical Specifications

Operating Junction

IGBT, Diode

- 40

150

°C

Temperature Range

Thermistor

- 40

125

Storage Temperature Range

- 40

125

Junction-to-Case

IGBT

0.38

°C/ W

Diode

0.8

Case-to-Sink

Module

0.06

(Heatsink Compound Thermal Conductivity = 1 W/mK)

5.5

m m

between two terminals)

8

surfaceoftheinsulatingmaterialbetween2terminals

)

T

Mounting torque to heatsink

(4)

3 ± 10%

Nm

W t

Weight

66

g

Parameters

Min

Typ

Max

Units

(3) Standard version only i.e. without optional thermistor

(4) A mounting compound is recommended and the torque should be checked after 3 hours to allow for the spread of the

compound. Lubricated threads

Fig. 1 - Typical Output Characteristics

V

CE

, Collector-to-Emitter Voltage (V)

Fig. 2 - Maximum Collector Current vs. Case

Temperature

T

C

, Case Temperature (°C)

0

20

40

60

80

100

120

25

50

75

100

125

150

1

10

100

0.1

1

10

Vge = 15V

20µs Pulse Width

T = 150˚C

J

T = 25˚C

J