3

16TTS.. S

Bulletin I2105 rev. D 12/98

www.irf.com

Triggering

P

GM

Max. peak Gate Power

8.0

W

P

2.0

1.5

A

- V

10

V

I

GT

Max. required DC Gate Current

90

mA

Anode supply = 6V, resistive load, T

to trigger

60

Anode supply = 6V, resistive load, T

35

V

GT

Max. required DC Gate Voltage

3.0

V

Anode supply = 6V, resistive load, T

to trigger

2.0

1.0

V

GD

Max. DC Gate Voltage not to trigger

0.25

T

I

GD

Max. DC Gate Current not to trigger

2.0

mA

T

Parameters

16TTS..S

Units

Conditions

Switching

Parameters

16TTS..S

Units

Conditions

t

gt

Typical turn-on time

0.9

µs

t

rr

Typical reverse recovery time

4

t

q

Typical turn-off time

110

T

J

Max. Junction Temperature Range

- 40 to 125

°C

T

stg

Max. Storage Temperature Range

- 40 to 125

°C

Soldering Temperature

240

°C

for 10 seconds (1.6mm from case)

R

thJC

Max. Thermal Resistance Junction

1.3

°C/W

DC operation

to Case

R

thJA

Typ. Thermal Resistance Junction

40

°C/W

to Ambient (PCB Mount)**

wt

Approximate Weight

2 (0.07)

g (oz.)

T

Case Style

Thermal-Mechanical Specifications

Parameters

16TTS..S

Units

Conditions

For recommended footprint and soldering techniques refer to application note #AN-994