PE426525

SPDT RF Switch

Page 10

DOC-77197-3 – (12/2016)

www.psemi.com

Die Mechanical Specifications

This section provides the die mechanical specifications for the PE426525.

Parameter

Min

Typ

Max

Unit

Test Condition

Die size, singulated (x, y)

2485 × 2139

2495 × 2149

2505 × 2159

μm

Including excess silicon,

maximum tolerance = ±10

μm

Wafer thickness

180

200

220

μm

Bump pitch

500

μm

Bump height

59.5

70

80.5

μm

Bump diameter

91

μm

UBM diameter

71

75

79

μm