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PE426525 Datasheet(PDF) 10 Page - Peregrine Semiconductor |
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PE426525 Datasheet(HTML) 10 Page - Peregrine Semiconductor |
10 / 13 page PE426525 SPDT RF Switch Page 10 DOC-77197-3 – (12/2016) www.psemi.com Die Mechanical Specifications This section provides the die mechanical specifications for the PE426525. Table 6 • Mechanical Specifications for PE426525 Parameter Min Typ Max Unit Test Condition Die size, singulated (x, y) 2485 × 2139 2495 × 2149 2505 × 2159 μm Including excess silicon, maximum tolerance = ±10 μm Wafer thickness 180 200 220 μm Bump pitch 500 μm Bump height 59.5 70 80.5 μm Bump diameter 91 μm UBM diameter 71 75 79 μm |
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